IPC T-50J

This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision J contains nearly 400 new or revised terms, including new terminology for chip scale and area array packaging, cable and wire harness technology, assembly processing, moisture sensitive components, and microvia technology. Also includes commonly used industry acronyms.

This product referenced by:ANSI/ASME Y14.24-2012 - Terms and Definitions for Interconnecting and Packaging Electronic Circuits
This product replaces:IPC T-50H - Terms and Definitions for Interconnecting and Packaging Electronic Circuits