ANSI/IPC 4104

Covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias.The 23 specification sheets included in IPC/JPCA-4104 specify the qualification and conformance requirements for such materials as photoimageable dielectric dry films and liquids, epoxy blends and coated foils. IPC/JPCA-4104 also includes six new test methods developed specifically for the testing of HDI and microvia materials.



Product Code(s): 4104(D)1

This product is related to: IPC 2315 - Design Guide for High Density Interconnects Microvias
IPC 4101 - Specifications for Base Materials for Rigid and Multilayer Printed Boards
IPC M-107 - Standards for Printed Board Materials Manual
IPC S-100 - Standards and Specifications Manual - Four Volume Set - Two Year Subscription Included
ANSI/IPC 9191 - Specifications for High Density Interconnect (HDI) and Microvia Materials
ANSI/IPC 6016 - Specifications for High Density Interconnect (HDI) and Microvia Materials
IPC M-107 - Specifications for High Density Interconnect (HDI) and Microvia Materials
IPC MI-660 - Specifications for High Density Interconnect (HDI) and Microvia Materials
IPC 4411-AM1 - Specifications for High Density Interconnect (HDI) and Microvia Materials
IPC TR-483 - Specifications for High Density Interconnect (HDI) and Microvia Materials