IPC T-50H

This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision H contains over 200 new or revised terms, including new terminology for ball grid array and chip scale packaging, via protection, conductor patterns, assembly processes, base materials and selective plating processes. Also includes commonly used industry acronyms and an index of terms by technology types for easy searching.

This product replaced by:IPC T-50J - Terms and Definitions for Interconnecting and Packaging Electronic Circuits
This product is related to: IPC 2152 - Terms and Definitions for Interconnecting and Packaging Electronic Circuits
This product replaces:IPC T-50G - Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Browse Product Family:

IPC T-50J
IPC T-50H
IPC T-50G

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