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IPC J-STD-006B

 

IPC J-STD-006B

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Association Connecting Electronics Industries / 01-Jan-2006 / 30 pages

 

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This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for special electronic grade solders. This is a quality control standard and is not intended to relate directly to the materials performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32.



This product referenced by:ANSI/AWS C3.11M/C3.11:2011 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications


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