IPC J-STD-006B
IPC J-STD-006B
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Association Connecting Electronics Industries / 01-Jan-2006 / 30 pages
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Association Connecting Electronics Industries / 01-Jan-2006 / 30 pages
This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for special electronic grade solders. This is a quality control standard and is not intended to relate directly to the materials performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32.
People Who Bought This Also Bought:
ANSI/IPC J-STD-004B- Requirements for Soldering FluxesANSI/IPC J-STD-005- Requirements for Soldering Pastes, Includes Amendment 1 (2007)ANSI/IPC J-STD-004A- Requirements for Soldering FluxesANSI/IPC J-STD-001D- Requirements for Soldered Electrical and Electronic AssembliesANSI/IPC J-STD-002C- Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires, Includes Amendment 1 (November 2008)IPC CC-830B- Qualification and Performance of Electrical Insulating Compound for Printed Wiring AssembliesANSI/IPC SM-840D- Qualification and Performance Specification of Permanent Solder MaskIPC 2221A- Generic Standard on Printed Board DesignIPC J-STD-020D-1- Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount DevicesAIAG B-10- Trading Partner Labels Implementation Guideline