IPC 2223B

Used in conjunction with IPC-2221A, IPC-2223B establishes the requirements for the design of single-sided, double-sided, multilayer, or rigid-flex flexible circuits. Enhancements within Revision B include updated adhesive and adhesiveless constructions, updated coverage for selective plating requirements, new definitions for cover materials, new requirements for the plated-through hole to rigid-flex interface and expanded coverage for nonfunctional lands. 30 pages. Released May 2008.

This product is related to: IPC 2221A - Generic Standard on Printed Board Design
IPC 2222 - Sectional Standard on Rigid PWB Design
IPC 2224 - Standard for Design of Printed Wiring Boards for PCMCIAs
ANSI/IPC 2225 - Sectional Design Standard for Organic Multichip Modules (MCML MCM-L Assemblies)
IPC 2226 - Sectional Design Standard for High Density Interconnect (HDI) Boards
ANSI/IPC 4202A - Sectional Design Standard for Flexible Printed Boards
This product replaces:IPC 2223A - Sectional Design Standard for Flexible Printed Boards

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IPC 2223B
IPC 2223A

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