IPC 7525B

This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included.

This product replaced by:IPC 7525B - Stencil Design Guidelines
This product replaces:IPC 7525A - Stencil Design Guidelines