IPC J-STD-020D-1

Updated with extended support for components used for lead free assembly! This standard identifies the classification levels of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress. It is used to determine which classification level should be used for initial reliability qualification. These devices can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during solder reflow attachment. Developed by IPC and JEDEC.

This product replaces:IPC J-STD-020D - Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

Browse Product Family:

IPC J-STD-020D-1
IPC J-STD-020D
IPC J-STD-020C
IPC J-STD-020B
IPC J-STD-020A

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