ANSI/IPC 6016

Establishes the specific electrical, mechanical and environmental requirements for organic HDI layers with microvia technology. The acceptance criteria of the HDI layers are organized into specification sheets that reflect typical end-use applications, such as cellular phones, avionics, automotive and personal computers. For use with IPC-6011.



Product Code(s): 6016(D)1

This product is related to: IPC 6011 - Generic Performance Specification for Printed Boards
ANSI/IPC 4104 - Specifications for High Density Interconnect (HDI) and Microvia Materials
IPC 2315 - Design Guide for High Density Interconnects Microvias
IPC 4101 - Specifications for Base Materials for Rigid and Multilayer Printed Boards
IPC PE-740A - Troubleshooting Guide for Printed Board Manufacture and Assembly
IPC S-100 - Standards and Specifications Manual - Four Volume Set - Two Year Subscription Included
ANSI/IPC SM-840C - Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards, Includes Amendment 1
ANSI/IPC 4101A - Qualification Performance Specification for High Density Interconnect (HDI) Layers or Boards

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