IPC 9502

This document describes manufacturing solder process limits that components subjected to IPC-9501, IPC-9504 and J-STD-020 would survive. It does not include optimum conditions for assembly, but rather guides to assure components are not damaged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents. Note: This document does not address the increased temperature requirements of lead-free solders.



Product Code(s): 9502(D)1

This product is related to: IPC 9501 - PWB Assembly Process Simulation for Evaluation of Electronic Components
IPC 9503 - Moisture Sensitivity Classification for Non-IC Components
ANSI/IPC 9504 - Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)
IPC HDBK-001 - Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies to Supplement ANSI/J-STD-001B
IPC J-STD-001C - Requirements for Soldered Electrical and Electronic Assemblies
IPC J-STD-020A - Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices
IPC J-STD-033 - Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
ANSI/IPC 9504 - PWB Assembly Soldering Process Guideline for Electronic Components
IPC 9701 - PWB Assembly Soldering Process Guideline for Electronic Components
IPC J-STD-020A - PWB Assembly Soldering Process Guideline for Electronic Components
IPC J-STD-033 - PWB Assembly Soldering Process Guideline for Electronic Components
IPC 9501 - PWB Assembly Soldering Process Guideline for Electronic Components
IPC 9503 - PWB Assembly Soldering Process Guideline for Electronic Components
This product is included inIPC M109 - PWB Assembly Soldering Process Guideline for Electronic Components
IPC 9500-K - PWB Assembly Soldering Process Guideline for Electronic Components