ANSI/IPC 9504

This document is another in a series and specifically addresses preconditioning of non-IC components used in electronic assembly. Do the components work with your process? That determination is the goal of these manufacturing process simulations; to ensure that the components chosen meet expected reliability requirements after exposure to factory processes. Developed for users and manufacturers, the procedure consists of a set of simulations, for non-IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes, and exposure to often-used cleaning materials.



Product Code(s): 9504(D)1

This product is related to: IPC 9503 - Moisture Sensitivity Classification for Non-IC Components
IPC 9502 - PWB Assembly Soldering Process Guideline for Electronic Components
IPC 9501 - PWB Assembly Process Simulation for Evaluation of Electronic Components
IPC HDBK-001 - Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies to Supplement ANSI/J-STD-001B
IPC J-STD-001C - Requirements for Soldered Electrical and Electronic Assemblies
IPC J-STD-020A - Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices
IPC J-STD-033 - Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
IPC 9501 - Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)
IPC 9701 - Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)
IPC J-STD-020A - Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)
IPC J-STD-033 - Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)
IPC 9502 - Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)
IPC 9503 - Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)
This product is included inIPC M109 - Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)
IPC 9500-K - Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)