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IPC SMC-TR-001

IPC SMC-TR-001

An Introduction to Tape Automated Bonding Fine Pitch Technology Association Connecting Electronics Industries / 01-Jan-1989 / 54 pages

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This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT.



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