IPC 7525B

Stencil Design Guidelines Association Connecting Electronics Industries / 01-Oct-2011 / 36 pages

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This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs.

This product replaces:IPC 7525B - Stencil Design Guidelines
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IPC 7525B
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