IPC J-STD-035

This test method defines the procedures for performing acoustic microscopy on nonhermetic encapsulated electronic components. This method provides users with an acoustic microscopy process flow for detecting defects non-destructively in plastic packages while achieving reproducibility.



Product Code(s): J-035(D)1

This product is related to: IPC J-STD-020A - Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices
IPC J-STD-033 - Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
IPC J-STD-020A - Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components
IPC J-STD-033 - Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components
This product is included inIPC M109 - Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

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