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IPC 9500-K

IPC 9500-K

Assembly Process Component Simulations, Guidelines and Classifications Package Association Connecting Electronics Industries / 01-Mar-2003 / 79 pages

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Heres a convenient and cost effective way to own the complete set of process simulation documents for component attachment. This set of four documents, 9501-9504, contains the information you need to help you select components that will be compatible with your assembly process. Learn about manufacturing solder process limits, moisture sensitivity classifications, preconditioning and conformal coatings, surface mount and through assembly process simulations.



Product Code(s): 9500K(D)1

This product includes:IPC 9501 - PWB Assembly Process Simulation for Evaluation of Electronic Components
IPC 9502 - PWB Assembly Soldering Process Guideline for Electronic Components
IPC 9503 - Moisture Sensitivity Classification for Non-IC Components
ANSI/IPC 9504 - Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)

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