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IPC J-STD-027

IPC J-STD-027

Mechanical Outline Standard for Flip Chip or Chip Scale Configurations Association Connecting Electronics Industries / 01-Feb-2003 / 20 pages

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THis standard establishes mechanical outline requirements for devices supplied in flip chip or CHip Size Package (CSP) formats. including die surface, die terminals, and interconnection balls/bumps/lands to the next level.



Product Code(s): J-027(D)1,J-027(D)1

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