IPC 6015

This specification establishes the specific requirements for organic mounting structures used to interconnect chip components, which in combination form the completed functional organic single-chip module (SCM-L) or organic multichip module (MCM-L) assembly and the quality and reliability assurance requirements that must be met for their acquisition. For use with IPC-6011.



Product Code(s): 6015(D)1

This product is related to: IPC 4101 - Specifications for Base Materials for Rigid and Multilayer Printed Boards
IPC DD-135 - Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
IPC MC-790 - Guidelines for Multichip Module Technology Utilization
IPC PE-740A - Troubleshooting Guide for Printed Board Manufacture and Assembly
IPC S-100 - Standards and Specifications Manual - Four Volume Set - Two Year Subscription Included
ANSI/IPC SM-840C - Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards, Includes Amendment 1
ANSI/IPC 2225 - Qualification Performance Specification for Organic Multichip Module Mounting and Interconnecting Structures
ANSI/IPC 4101A - Qualification Performance Specification for Organic Multichip Module Mounting and Interconnecting Structures