IPC J-STD-026

This new standard addresses semiconductor flip chip design requirements. Provides information intended for applications utilizing standard semiconductor substrates, materials, assembly and test methods commensurate with established fabrication, bumping, test and handling practices. Covered in the standard are electrical, thermal and mechanical chip design parameters and methodologies, as well as the reliability aspects associated with these conditions and processes. The information applies to all new designs as well as modifications of non-flip chip designs



Product Code(s): J-026(D)1

This product is related to: IPC J-STD-012 - Implementation of Flip Chip and Chip Scale Technology
IPC J-STD-028 - Performance Standard fo Construction of Flip Chip and Chip Scale Bumps
IPC SM-784 - Guidelines for Chip-on-Board Technology Implementation
IPC J-STD-012 - Semiconductor Design Standard for Flip Chip Applications
IPC J-STD-013 - Semiconductor Design Standard for Flip Chip Applications
IPC J-STD-028 - Semiconductor Design Standard for Flip Chip Applications
IPC SM-784 - Semiconductor Design Standard for Flip Chip Applications