IPC 2315

High density interconnect (HDI) and microvia technologies are the PWB industrys current manufacturing challenge. Published jointly with the Japan Printed Circuits Association, IPC-2315 provides an easy to follow tutorial on the selection of HDI and microvia design rules and structures. The document addresses various considerations when designing an HDI printed wiring board that include: design examples and processes, selection of materials, general descriptions, and various microvia technologies. This industry publication offers designers and manufacturers one source for reliable design and manufacturability information forcommonly produced HDI boards. It includes over 30 full color illustrations to assist the user. 33 pages. Released June 2000.



Product Code(s): 2315(D)1,2315(D)1

This product is related to: IPC M-106 - Technology Reference for Design Manual
IPC M-106 - Design Guide for High Density Interconnects Microvias
ANSI/IPC 2221-KIT - Design Guide for High Density Interconnects Microvias
ANSI/IPC 4104 - Design Guide for High Density Interconnects Microvias
ANSI/IPC 6016 - Design Guide for High Density Interconnects Microvias