IPC 4553A

This specification sets requirements based on performance criteria for the use of Immersion Silver (IAg) as a surface finish for printed circuit boards. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) companies and original equipment manufacturers (OEM). IAg is a thin immersion deposit over copper. It is a multifunctional surface finish, applicable to soldering. It may also be applicable for some press fit connections and as a contact surface. It has the potential to be suitable for aluminum wire bonding. The immersion silver protects the underlying copper from oxidation over its intended shelf life. Exposure to moisture and air contaminants, such as sulfur and chlorine, may negatively impact the useful life of the deposit. The impact can range from a slight discoloration of the deposit to the pads turning completely black. Proper packaging is a requirement. Note that, in this revision, both a single thickness range is in place and an upper limit for immersion silver thickness has been established.

This product references:IPC J-STD-003B - Solderability Tests for Printed Boards
IPC 2221A - Generic Standard on Printed Board Design
IPC 6011 - Generic Performance Specification for Printed Boards
IPC 6012B - Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1
IPC 6013B - Qualification and Performance Specification for Flexible Printed Boards
MIL MIL-STD-883G - MICROCIRCUITS(SUPERSEDING MIL-STD-883F)
This product replaces:ANSI/IPC 4553 - Specification for Immersion Silver Plating for Printed Circuit Boards

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IPC 4553A
ANSI/IPC 4553

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