IPC SM-784

Discusses chip types, board selection, design issues and thermal transfer methods for Chip on Board (COB) applications. Details wire bonding, TAB and flip chip designs and provides information on mounting materials, including adhesives, wires and various mechanical bonding techniques.



Product Code(s): SM-784(D)1

This product is related to: IPC J-STD-012 - Implementation of Flip Chip and Chip Scale Technology
IPC J-STD-013 - Implementation of Ball Grid Array and Other High Density Technology
IPC J-STD-026 - Semiconductor Design Standard for Flip Chip Applications
IPC J-STD-028 - Performance Standard fo Construction of Flip Chip and Chip Scale Bumps
IPC M-103 - Standards for Surface Mount Assemblies Manual
ANSI/IPC SM-840C - Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards, Includes Amendment 1
IPC J-STD-012 - Guidelines for Chip-on-Board Technology Implementation
IPC J-STD-013 - Guidelines for Chip-on-Board Technology Implementation
IPC J-STD-026 - Guidelines for Chip-on-Board Technology Implementation
IPC J-STD-028 - Guidelines for Chip-on-Board Technology Implementation
IPC M-103 - Guidelines for Chip-on-Board Technology Implementation