IPC TR-579

Approximately 200,000 plated through-holes, covering primarily electroplated but also electroless technology, were exposed to several different thermal cycles. A number of PTH diameters, board constructions and plating thicknesses were evaluated.



Product Code(s): TR-579(D)1

This product is related to: IPC D-279 - Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
IPC M-105 - Rigid Printed Board Manual
ANSI/IPC SM-785 - Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments
IPC M-105 - Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs
IPC TR-578 - Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs