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IPC DD-135

IPC DD-135

Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules Association Connecting Electronics Industries / 01-Aug-1995 / 36 pages

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This standard has been written for deposited organic interlayer dielectric materials under evaluation for MCM-D applications. The standard and test methods have been written without bias towards any particular class of materials.



Product Code(s): DD-135(D)1

This product is related to: IPC D-859 - Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
IPC HM-860 - Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
IPC 6015 - Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules

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