IPC SM-780

This document examines key issues in advanced packaging techniques. Provides information on what types of parts are available, the techniques and processes necessary for their proper use, possible advantages/disadvantages or problems, how to start implementation and where to find additional information.



Product Code(s): SM-780(D)1

This product is related to: ANSI/IPC A-610C - Acceptability of Electronic Assemblies
IPC J-STD-001C - Requirements for Soldered Electrical and Electronic Assemblies
IPC M-103 - Standards for Surface Mount Assemblies Manual
IPC MC-790 - Guidelines for Multichip Module Technology Utilization
IPC M-103 - Component Packaging and Interconnecting with Emphasis on Surface Mounting