IPC HM-860

Covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate may include passive elements.



Product Code(s): HM-860(D)1

This product is related to: IPC DD-135 - Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
IPC S-100 - Standards and Specifications Manual - Four Volume Set - Two Year Subscription Included
IPC TF-870 - Qualifications and Performance of Polymer Thick Film Printed Boards
IPC D-859 - Specification for Multilayer Hybrid Circuits
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