IPC CI-408

Provides information on design characteristics and the application of solderless surface mount connectors, including conductive adhesives, in order to aid IC package to board interconnection.



Product Code(s): CI-408(D)1

This product is related to: IPC 3406 - Guidelines for Electrically Conductive Surface Mount Adhesives
IPC 3408 - General Requirements for Anisotropically Conductive Adhesives Films
IPC C-406 - Design and Application Guidelines for Surface Mount Connectors
IPC M-106 - Technology Reference for Design Manual
IPC C-406 - Solderless Surface Mount Connectors Design Characteristics and Application Guidelines
IPC M-106 - Solderless Surface Mount Connectors Design Characteristics and Application Guidelines