IPC D-279

Establishes design concepts, guidelines and procedures for reliable printed wiring assemblies. Focuses on SMT or mixed technology PWAs, specifically addressing the interconnect structure and the solder joint itself. Discusses substrates, components, attachment materials, costings and assembly processes and testing considerations. In addition, this document contains detailed appendices covering: solder attachments; plated-through via structures; insulation resistance; thermal considerations; environmental stresses; coefficient of thermal expansion; electrostatic discharge; solvents; testability; corrosion aerospace and high altitude concerns.



Product Code(s): D-279(D)1

This product is related to: IPC 9701 - Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
IPC HDBK-001 - Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies to Supplement ANSI/J-STD-001B
IPC J-STD-001C - Requirements for Soldered Electrical and Electronic Assemblies
IPC M-106 - Technology Reference for Design Manual
ANSI/IPC SM-840C - Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards, Includes Amendment 1
IPC 9701 - Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
IPC M-106 - Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
ANSI/IPC SM-785 - Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
IPC TR-578 - Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
IPC TR-579 - Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
This product referenced by:ANSI/IPC A-610D - Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

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