IPC D-859

This standard covers the requirements and considerations for the design of multilayer hybrid circuits based on industry manufacturing capabilities.



Product Code(s): D-859(D)1

This product is related to: IPC DD-135 - Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
IPC HM-860 - Specification for Multilayer Hybrid Circuits
IPC M-106 - Technology Reference for Design Manual
IPC S-100 - Standards and Specifications Manual - Four Volume Set - Two Year Subscription Included
IPC TF-870 - Qualifications and Performance of Polymer Thick Film Printed Boards
IPC M-106 - Design Standard for Thick Film Multilayer Hybrid Circuits
This product referenced by:ANSI/ASME Y14.24-2012 - Design Standard for Thick Film Multilayer Hybrid Circuits