IPC 7525A

Now includes support for stencils used with lead free processes.

This document provides guidelines for the design and fabrication of stencils for solder paste and surface-mount adhesive. Stencil design for various surface-mount technology, as well as mixed technology with through-hole or flip chip components is discussed. This includes differences for tin lead and lead free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included.

This product replaced by:IPC 7525B - Stencil Design Guidelines
This product replaces:IPC 7525 - Stencil Design Guidelines

Browse Product Family:

IPC 7525B
IPC 7525B
IPC 7525A
IPC 7525

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