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JEDEC JS 9702

JEDEC JS 9702

IPC/JEDEC-9702: MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS (IPC/JEDEC-9702) JEDEC Solid State Technology Association / 01-Jun-2004 / 19 pages

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This publication specifies a common method of establishing the fracture resistance of board-level device interconnects to flexural loading during non-cyclic board assembly and test operations. Monotonic bend test qualification pass/fail requirements are typically specific to each device application and are outside the scope of this document.



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