IPC 7530

During mass soldering, it is important that all solder joints reach the minimum soldering (reflow) temperature to assure metallurgical bonding of thesolder alloy and the base metals to be soldered. Metallurgical bonding requires that both surfaces to be soldered, as well as the solder, reach thisminimum soldering temperature for a sufficient time to allow the wetting of the solder surfaces. This document provides guidelines for theconstruction of appropriate profiling test vechicles and various techniques and methodologies for temperature profiling.



Product Code(s): 7530(D)1

This product is related to: IPC HDBK-001 - Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies to Supplement ANSI/J-STD-001B
IPC J-STD-001C - Requirements for Soldered Electrical and Electronic Assemblies
IPC HDBK-001 - Guidelines for Temperature Profiling for Mass Soldering (Reflow Wave) Processes
IPC J-STD-001C - Guidelines for Temperature Profiling for Mass Soldering (Reflow Wave) Processes
IPC J-STD-020A - Guidelines for Temperature Profiling for Mass Soldering (Reflow Wave) Processes
IPC J-STD-033 - Guidelines for Temperature Profiling for Mass Soldering (Reflow Wave) Processes
IPC TR-460A - Guidelines for Temperature Profiling for Mass Soldering (Reflow Wave) Processes
IPC 7525 - Guidelines for Temperature Profiling for Mass Soldering (Reflow Wave) Processes

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