IPC 3408

This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board assembly. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-to-flexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product.



Product Code(s): 3408(D)1

This product is related to: IPC 3406 - Guidelines for Electrically Conductive Surface Mount Adhesives
IPC CA-821 - General Requirements for Thermally Conductive Adhesives
IPC M-103 - Standards for Surface Mount Assemblies Manual
IPC S-100 - Standards and Specifications Manual - Four Volume Set - Two Year Subscription Included
IPC SM-817 - General Requirements for Dielectric Surface Mounting Adhesives
IPC 3406 - General Requirements for Anisotropically Conductive Adhesives Films
IPC CA-821 - General Requirements for Anisotropically Conductive Adhesives Films
IPC CI-408 - General Requirements for Anisotropically Conductive Adhesives Films
IPC M-103 - General Requirements for Anisotropically Conductive Adhesives Films
IPC SM-817 - General Requirements for Anisotropically Conductive Adhesives Films