JEDEC J-STD-033C

The advent of surface mount devices (SMDs) introduced a new class of quality and reliability concerns regarding damagefrom the solder reflow process, such as cracks and delamination. This document describes the standardized levels of floorlifeexposure for moisture/reflow sensitive SMDs along with the handling, packing, and shipping requirements necessary toavoid moisture/reflow related failures. Companion documents J-STD-020 and J-STD-075 define the classification procedureand JEP113 defines the labeling requirements.

This product replaces:JEDEC J-STD-033B.1 - JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES