ASTM B32-08

1.1 This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-silver, and lead-tin-silver, used for the purpose of joining together two or more metals at temperatures below their melting points. Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not covered by this specification as they are under the auspices of IPC - Association Connecting Electronic Industries.

1.1.1 These solders include those alloys having a liquidus temperature not exceeding 800F (430C).

1.1.2 This specification includes solders in the form of solid bars, ingots, powder and special forms, and in the form of solid and flux-core ribbon, wire, and solder paste.

1.2 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to become familiar with all hazards including those identified in the appropriate Material Safety Data Sheet (MSDS) for this product/material as provided by the manufacturer, to establish appropriate safety and health practices, and determine the applicability of regulatory limitations prior to use.



Keywords: bar; flux; flux cored solder; ingot; leadspan class='unicode'#x2013;/spansilver alloys; leadspan class='unicode'#x2013;/spantin alloys; leadspan class='unicode'#x2013;/spantinspan class='unicode'#x2013;/spansilver alloys; powder; ribbon; solder alloy; solder metal; solder uses; tinspan class='unicode'#x2013;/spanantimony alloys; tinspan class='unicode'#x2013;/spancopper alloys; tinspan class='unicode'#x2013;/spansilver alloys; wire; Lead metals/alloys--specifications; Lead-tin alloys/coatings--specifications; Powder metallurgy--specifications; Solder/soldering applications--specifications; Core solder; Flux cored solder; Ingots; Lead-silver alloys; Lead-tin-silver alloys; Tin-antimony alloys; Tin-copper alloys; Tin-silver alloys; ICS Number Code 77.120.40 (Nickel, chromium and their alloys)

This product referenced by:ICC IMC-2006 - Standard Specification for Solder Metal
ICC SUPPLEMENT-2007 - Standard Specification for Solder Metal
ICC IPC-2006 - Standard Specification for Solder Metal
ANSI/AWS C3.11M/C3.11:2011 - Standard Specification for Solder Metal
ANSI/ASME B16.18-2012 - Standard Specification for Solder Metal
ANSI/AWS B2.3/B2.3M:2012 - Standard Specification for Solder Metal
ANSI/ASME B16.22-2012 - Standard Specification for Solder Metal
This product replaces:ASTM B32-04 - Standard Specification for Solder Metal

Browse Product Family:

ASTM B32-08
ASTM B32-04
ASTM B32-03
ASTM B32-00
ASTM B32-00e1

People Who Bought This Also Bought:
ANSI/IPC J-STD-005- Requirements for Soldering Pastes, Includes Amendment 1 (2007)ANSI/IPC J-STD-004B- Requirements for Soldering FluxesIPC J-STD-006B- Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering ApplicationsASTM B49-08- Standard Specification for Copper Rod Drawing Stock for Electrical PurposesASTM B753-07- Standard Specification for Thermostat Component Alloys