BS EN 61191-1:1999

Specifies materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mounted and related assembly technologies. Also includes recommendations for good manufacturing processes.

Cross References:
IPC-TM-650 2.3.25
IPC-TM-650 2.3.26.1
IPC-TM-650 2.3.27
IPC-TM-650 2.3.28
IPC-TM-650 2.3. 22
IPC-TM-650 2.6.3.3
IPC-PC-90
IPC-OI-645
IPC-SM-817
J-STD-002
J-STD-003
J-STD-004
J-STD-005
J-STD-006
J-STD-020
ISO 12226-1
IEC 61189-4
IEC 61193-1
IEC 61189-2:1997
IEC 61118-5-1
IEC 61118-5-2
IEC 61118-5-3
IEC 61118-5-4
IEC 61118-5-5
IEC 61118-5-6
IEC 61118-5-7
IEC 61190-1-5
IEC 61249-8-4
IEC 61249-8-5
IEC 61249-8-6
IEC 62326-9
IEC 61193-3
IEC 61188-7
IEC 60050(541):1990
IEC 60721-3-1:1987
IEC 60721-3-1/A1:1991
EN 60721-3-1:1993
IEC 61188-1-1:1997
EN 61188-1-1:1997
IEC 61188-2
IEC 61189-1:1997
EN 61189-1:1997
IEC 61189-3:1997
EN 61189-3:1997
IEC 61190-1-1
IEC 61190-1-2
IEC 61191-2:1998
IEC 61191-3:1998
IEC 61191-4:1998
IEC 61192-1
IEC 61249-8-1
IEC 61249-8-2
IEC 61249-8-3
IEC 61249-8-8:1997
EN 61249-8-8:1997
IEC 61340-5-1
IEC 61340-5-2
IEC 61760-2:1998
EN 61760-2:1998
IEC 62326-1:1996
EN 62326-1:1997
IEC QC 200012:1996
CECC 100015
ISO 9001:1994
ISO 9002:1994
ISO 9453:1990
ISO 9454-1:1990
ISO/DIS 9454-2




Keywords: Printed-circuit boards; Printed circuits; Integrated circuits; Electronic equipment and components; Semiconductor devices; Microassembling ; Assembling; Soldering; Assessed quality; Quality assurance; Quality assurance systems; Electrical components; Components; Classification systems; Design; Personnel; Working conditions (physical); Fluxes (materials); Contaminants; Cleaning; Verification; Acceptance (approval); Electrical resistance; Flatness (surface); Defects; Coating processes; Performance; Process control; Ordering; Approval testing; Conformity; Joints; Wires; Inspection; Wettability; Visual inspection (testing); Surface mounting; Surface mounting devices

Product Code(s): 01555716,01555716

This product references:BS EN 61188-1-1:1997 - Printed boards and assemblies. Design and use. Generic requirements. Flatness considerations for electronic assemblies
BS EN 61189-3:1997 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards)
BS EN 61249-8-8:1997 - Materials for interconnection structures. Sectional specification set for non-conductive films and coatings. Temporary polymer coatings
BS EN 61189-1:1997 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods and methodology
BS EN 61760-2:1998 - Surface mounting technology. Transportation and storage conditions of surface mounting devices (SMD). Application guide
IEC 61192-1 Ed. 1.0 b:2003 - Workmanship requirements for soldered electronic assemblies - Part 1: General
IEC/TS 61340-5-1 Ed. 1.0 b:1998 - Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
ISO 9001:1994 - Quality systems - Model for quality assurance in design, development, production, installation and servicing
IEC 61193-1 Ed. 1.0 b:2001 - Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
IEC/TS 61340-5-2 Ed. 1.0 b:1999 - Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide
IEC 61190-1-1 Ed. 1.0 b:2002 - Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 61190-1-2 Ed. 1.0 b:2002 - Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly
ISO 9453:1990 - Soft solder alloys - Chemical compositions and forms
ISO 9454-1:1990 - Soft soldering fluxes - Classification and requirements - Part 1: Classification, labelling and packaging