BS 123600-003:2001

To be read in conjunction with BS 123000:2001,BS 123600:2001

Cross References:
BS EN 123000
BS 2011-2.1Ca
IEC 60068-2-3
BS 2011-2.1Ta
IEC 60068-2-54
BS 4584-103.1
BS 4727-1:Group 11
IEC 60194
BS 6221-2:1991
IEC 60326-2:1990
BS 123000:2001
BS 123200:2001
BS 123500-003:2001
BS 123600:2001
BS EN 60249-2-8
IEC 60249-2-8
BS EN 60249-2-11
IEC 60249-2-11
BS EN 60249-2-12
IEC 60249-2-12
BS EN 60249-2-13
IEC 60249-2-13
BS EN 60249-2-15
IEC 60249-2-15
BS EN ISO 1463:1982
BS EN ISO 3543:1981
ANSI/IPC A-600F




Keywords: Electronic equipment and components; Multilayered printed boards; Printed-circuit boards; Printed circuits; Quality assurance systems; Capability approval; Assessed quality; Approval testing; Specification (approval); Detail specification

Product Code(s): 30046460,30046460

This product references:BS 6221-2:1991 - Printed wiring boards. Methods of test
BS 123600:2001 - System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections
BS 123200:2001 - System of quality assessment. Sectional specification. Rigid double-sided printed boards with plated-through holes
BS 123500-003:2001 - System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections
BS 123000:2001 - System of quality assessment. Generic specification. Printed boards
IEC 60194 Ed. 4.0 en:1999 - Printed board design, manufacture and assembly - Terms and definitions
IEC 60068-2-54 Ed. 1.0 b:1985 - Environmental testing. Part 2: Tests. Test Ta: Soldering - Solderability testing by the wetting balance method
This product referenced by:BS 123600:2001 - System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections