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BS EN 62137-3:2012

Standard Number
BS EN 62137-3:2012
Title
Electronics assembly technologySelection guidance of environmental and endurance test methods for solder joints
Status
Current
Publication Date
31 March 2012
Cross References
IEC 60194, IEC 61188-5, IEC 61249-2-7, IEC 62137-1-1:2007, IEC 62137-1-2:2007, IEC 62137-1-3:2008, IEC 62137-1-4:2009, IEC 62137-1-5:2009, IEC 60068-1:1998, IEC 60068-2-2, IEC 60068-2-14, IEC 60068-2-78, IEC 61760-1, IEC 62137:2004, EN 60194, EN 61188-5, EN 61249-2-7, EN 62137-1-1:2007, EN 62137-1-2:2007, EN 62137-1-3:2009, EN 62137-1-4:2009, EN 62137-1-5:2009
Replaces
DD IEC/PAS 62137-3:2008

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Descriptors
Electronic equipment and components, Surface mounting devices, Integrated circuits, Printed-circuit boards, Soldered joints, Soldering, Solders, Environmental testing, Endurance testing, Mechanical testing, Thermal testing, Life (durability)
Title in French
Techniques dassemblage des composants lectroniques. Guide de choix des mthodes dessai denvironnement et dendurance des joints brass
Title in German
Montageverfahren fr elektronische Baugruppen. Leitfaden fr die Auswahl von Umwelt- und (Lebens)dauerprfungen fr Ltverbindungen
Pages
47
File Size
1.832 MB
Price
178.00

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