| Standard Number |
BS EN 62047-9:2011 |
| Title |
Semiconductor devices. Micro-electromechanical devicesWafer to wafer bonding strength measurement for MEMS |
| Status |
Current |
| Publication Date |
31 January 2013 |
| Cross References |
IEC 60749-19, ISO 6892-1:2009, ASTM E399-06e2:2008, EN 60749-19, EN ISO 6892-1:2009, IEC 62047-2, ASTM E8M, IEC 60747-14-1, IEC 62047-4, EN 62047-2, EN 62047-4 |