Viewed products

Home>BS EN 61190-1-3:2007+A1:2010

BS EN 61190-1-3:2007+A1:2010

Standard Number
BS EN 61190-1-3:2007+A1:2010
Title
Attachment materials for electronic assemblyRequirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
Status
Current
Publication Date
31 July 2007
Cross References
IEC 60194, IEC 61189-5, IEC 61189-6, IEC 61190-1-1:2002, IEC 61190-1-2, ISO 9001, ISO 9453:2006, ISO 9454-1:1990, ISO 9454-2:1998, EN 60194:2006, EN 61189-5:2006, EN 61189-6:2006, EN 61190-1-1:2002, EN 61190-1-2:2007, EN ISO 9001:2000, EN ISO 9453:2006, EN 29454-1:1993, EN ISO 9454-2:2000
Replaces
BS EN 61190-1-3:2002

More details

Download

PDF AVAILABLE FORMATS IMMEDIATE DOWNLOAD
$64.80

$162.00

(price reduced by 60 %)

Descriptors
Electronic equipment and components, Electronic engineering, Electrical connections, Bonding, Soldering, Solders, Fluxes (materials), Bars (materials), Particulate materials, Pastes, Classification systems, Quality control, Quality assurance, Test methods
Title in French
Matriaux de fixation pour les assemblages lectroniques. Exigences relatives aux alliages braser de catgorie lectronique et brasures solides fluxes et non fluxes pour les applications de brasage lectronique
Title in German
Verbindungsmaterialien fr Baugruppen der Elektronik. Anforderungen an Elektroniklote und an Festformlote mit oder ohne Flussmittel fr das Lten von Elektronikprodukten
Pages
40
File Size
1.063 MB
Price
162.00

Contact us