Printed board assembliesEvaluation criteria for voids in soldered joints of BGA and LGA and measurement methods
Status
Current
Publication Date
31 May 2010
Cross References
IEC 60068-1:1988, IEC 60068-1:1988/AMD 1:1992, IEC 60194:2006, EN 60068-1:1994, EN 60194:2006, IEC 61190-1-3:2007, IEC 61191-1, IPC-7095B:2008, EN 61190-1-3:2007, EN 61191-1
