Descriptors
Semiconductor devices, Integrated circuits, Electronic equipment and components, Mechanical testing, Environmental testing, Climate, Electrical equipment, Electrical components, Shear strength, Shear testing, Strength of materials, Substrates (insulating), Quality control
Title in French
Dispositifs semiconducteurs. Mthodes dessais mcaniques et climatiques. Rsistance de la pastille au cisaillement
Title in German
Halbleiterbauelemente. Mechanische und klimatische Prfverfahren. Prfung der Chip-Bondfestigkeit
Pages
10
File Size
441.5 KB
Price
82.00