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BS EN 60749-20-1:2009

Standard Number
BS EN 60749-20-1:2009
Title
Semiconductor devices. Mechanical and climatic test methodsHandling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
Status
Current
Publication Date
31 July 2009
Cross References
IEC 60749-20, IEC 60749-30, EN 60749-20, EN 60749-30:2005, IPC/JEDEC J-STD-033, IEC 60749-37, IEC 60749-39, EN 60749-37:2008, EN 60749-39:2006

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Descriptors
Semiconductor devices, Integrated circuits, Electronic equipment and components, Mechanical testing, Environmental testing, Climate, Surface mounting devices, Materials handling, Packaging, Labelling (process), Transportation, Thermal testing, Soldering, Damp-heat tests, Environment (working)
Title in French
Dispositifs semiconducteurs. Mthodes dessais mcaniques et climatiques. Manipulation, emballage, tiquetage et transport des composants pour montage en surface sensibles leffet combin de lhumidit et de la chaleur de brasage
Title in German
Halbleiterbauelemente. Mechanische und klimatische Prfverfahren. Handhabung, Verpackung, Kennzeichnung und Transport oberflchenmontierbarer Bauelemente, die empfindlich gegen die Kombination von Feuchte und Ltwrme sind
Pages
38
File Size
977.1 KB
Price
162.00

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