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BS EN 61190-1-2:2007

Standard Number
BS EN 61190-1-2:2007
Title
Attachment materials for electronic assemblyRequirements for soldering pastes for high-quality interconnects in electronics assembly
Status
Current, Work in hand
Publication Date
31 July 2007
Cross References
IEC 60194, IEC 61189-5, IEC 61189-6, IEC 61190-1-1, IEC 61190-1-3, IEC 61191-1, IEC 61191-2, IEC 61191-3, IEC 61191-4, ISO 9000, ISO 9001, ISO 9453, ISO 9454-2, ISO 10012-1, EN 60194:2006, EN 61189-5:2006, EN 61189-6:2006, EN 61190-1-1:2002, EN 61190-1-3:2007, EN 61191-1:1998, EN 61191-2:1998, EN 61191-3:1998, EN 61191-4:1998, EN ISO 9000:2005, EN ISO 9001:2000, EN ISO 9453:2006, EN ISO 9454-2:2000, EN 30012-1:1993
Replaces
BS EN 61190-1-2:2002

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Descriptors
Electronic equipment and components, Electronic engineering, Electrical connections, Bonding, Soldering, Soldered connectors, Solders, Pastes, Quality control, Quality assurance, Classification systems
Title in French
Matriaux de fixation pour les assemblages lectroniques. Exigences relatives aux crmes de brasage pour les interconnexions de haute qualit dans les assemblages de composants lectroniques
Title in German
Verbindungsmaterialien fr Baugruppen der Elektronik. Anforderungen an Lotpaste fr hochwertige Verbindungen in der Elektronikmontage
Pages
22
File Size
1.36 MB
Price
100.00

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