BS EN 61189-2:2006

Standard Number
BS EN 61189-2:2006
Title
Test methods for electrical materials, printed boards and other interconnection structures and assembliesTest methods for materials for interconnection structures
Status
Current
Publication Date
30 November 2006
Cross References
IEC 60068-1:1988, IEC 60068-2-2:1974, IEC 60068-2-78:2001, IEC 60093:1980, IEC 60243-1:1998, IEC 61189-3:1997, ISO 3274:1996, ISO 9001:2000, ANSI/UL-94:1993, EN 60068-1:1994, EN 60068-2-2:1993, EN 60068-2-78:2001, CENELEC HD 429 S1:1983, EN 60243-1:1998, EN 61189-3:1997, EN ISO 3274:1997, EN ISO 9001:2000
Replaces
BS EN 61189-2:1997, IEC 61189-2:1997

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Descriptors
Printed circuits, Printed-circuit boards, Electronic equipment and components, Electrical insulating materials, Testing conditions, Chemical analysis and testing, Accuracy, Precision, Chemical-resistance tests, Sodium hydroxide, Test specimens, Impregnated materials, Gelation, Time, Plastics, Determination of content, Compressible flow, Flow measurement, Electrical testing, Electrical resistivity, Resistance measurement, Electric arcs, Test equipment, Volatile matter determination, Thermal testing, Thermal-shock tests, Blistering, Pull-out tests, Peeling tests, High-temperature testing, Cleaning, Position, Electrodes
Title in French
Methodes dessais pour les materiaux electriques, les cartes imprimees et autres structures dinterconnexion et ensembles. Methodes dessai des materiaux pour structures dinterconnexion
Title in German
Pruefverfahren fuer Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen. Pruefverfahren fuer Materialien fuer Verbindungsstrukturen
Pages
128
File Size
2.171 MB
Price
242.00